Frore Systems and Lenovo Unveil World’s First Ultra-Slim Ultra-Quiet Notebook Featuring AirJet Solid-State Active Cooling

Frore Systems and Lenovo Unveil World’s First Ultra-Slim Ultra-Quiet Notebook Featuring AirJet Solid-State Active Cooling

PR Newswire

In an industry first, Frore Systems and Lenovo present a concept, ultra-slim ultra-quiet notebook featuring the Lenovo Active Flow Thermal Solution, powered by AirJet.

BERLIN, Sept. 3, 2026 /PRNewswire/ — Frore Systems today announced that its collaboration with Lenovo has reached new heights with the unveiling of a new concept notebook featuring the Lenovo Active Flow thermal solution with AirJet® solid-state active cooling, on display at the Lenovo Innovation World ’26 event in Berlin, Germany.

Lenovo’s AeroBlade concept notebook showcases the benefits the industry has been anticipating from the Frore Systems and Lenovo partnership, including a thinner, lighter and silent design in a high-performance, ultra-slim notebook.

“We are honored to be working with Lenovo, the world’s number one PC maker and an innovation front runner shaping the future of intelligent computing, to showcase AirJet,” said Seshu Madhavapeddy, CEO and Founder of Frore Systems. “AirJet® Mini removes thermal barriers that have traditionally limited ultra-compact systems, allowing consumer products like super slim and light notebooks, tablets, and wearables to achieve higher sustained performance and operate in silence. Lenovo’s new AeroBlade concept notebook featuring the Lenovo Active Flow thermal solution is a perfect notebook to demonstrate the many advantages of solid-state active cooling powered by AirJet® Mini. This collaboration unlocks the new Thermal Stack that will enable the next generation of ultra-compact Edge AI devices. This is just the beginning.”

AirJet® – Built for the Rise of AI Reasoning Models

As Edge AI evolves from simple inference toward AI reasoning models and Agentic services, workloads are becoming sustained and compute intensive. These models spend more time “thinking” and “orchestrating,” placing significantly greater thermal demands on edge devices.

AirJet®Mini is designed specifically to support this shift – enabling processors to sustain higher performance levels without throttling. This advance aligns with Frore’s Law, the company’s long-term vision to double thermal performance every two years – keeping pace with AI compute demand.

AirJet®Mini Technical Highlights

  • Heat dissipation: 7.5 W (50% increase over AirJet Mini G1)
  • Dimensions: just 27mm × 41.5mm × 2.65 mm, supporting ultra-compact form factors
  • Back pressure: 2,000 Pa (~10x higher than a fan), enabling dustproof and water-resistant devices
  • Noise level: 21 dBA in system, enabling silent operation
  • Design: solid-state, with no moving mechanical parts, delivering long life

AirJet®Mini generates high-velocity pulsating air jets that efficiently eject heat from compact enclosures, enabling sleek, light, ultra-compact, silent, vibration-free, dustproof, and water-resistant device designs. AirJet enhances performance across numerous devices from notebooks, tablets, Mini-PCs, smartphones, 5G WiFi Hotspots, cameras and SSDs, to the tsunami of consumer and industrial IOT devices.

The new Lenovo AeroBlade concept notebook is being shown at the Lenovo Innovation World ’26 Event in Berlin, Germany on September 3, 2026. 

About Frore Systems: Frore Systems is a pioneer in advanced thermal technologies that unleash performance across data centers and edge devices. The company’s flagship solutions include AirJet®, the world’s first solid-state active air-cooling chip used in consumer, industrial, and IoT markets delivering higher performance in ultra-compact, silent, light, dustproof and water-resistant edge devices; LiquidJet®, the 3D ultra short-loop multi-stage liquid cooling coldplate for data centers delivering higher GPU performance, AI token throughput, improved PUE and reduced TCO; and LiquidJet® Nexus, a light weight integrated coldplate system that integrates multiple LiquidJets and eliminates all hoses, connectors and manifolds enabling ½U compute trays. Frore Systems’ patented cooling technologies are integrated into products from major OEMs and system builders worldwide. Headquartered in Silicon Valley, with manufacturing operations in Taiwan, Frore Systems is redefining thermal architecture for the AI era. For more information, visit: www.froresystems.com

Media Contact:       

Sue Ryan – VP Marketing, Frore Systems
sue@froresystems.com 
Cell: +1 314 914 5008

Frore Systems

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SOURCE Frore Systems, Inc.